Chip Mounter Market

Market Definition

The market encompasses the global industry involved in the manufacturing, distribution, and integration of surface-mount technology (SMT) equipment used for placing semiconductor devices onto printed circuit boards (PCBs).

This market includes equipment suppliers, service providers, and end users across electronics manufacturing sectors such as consumer electronics, automotive, telecommunications, and industrial automation. The report examines critical driving factors, industry trends, regional developments, and regulatory frameworks impacting market growth through the projection period.

Chip Mounter Market Overview

The global chip mounter market size was valued at USD 6.32 billion in 2023 and is projected to grow from USD 6.62 billion in 2024 to USD 9.55 billion by 2031, exhibiting a CAGR of 5.37% during the forecast period.

This market is registering robust growth, driven by the rapid expansion of the electronics manufacturing sector and increasing demand for compact, high-performance electronic devices. The need for efficient and high-speed surface-mount technology solutions has surged as industries such as consumer electronics, automotive, telecommunications, and industrial automation continue to adopt advanced technologies.

The proliferation of smart devices, Electric Vehicles (EVs), and IoT-enabled systems has fueled investments in SMT lines, with chip mounters playing a crucial role in achieving high precision and throughput.

Major companies operating in the chip mounter industry are ASM International N.V., Sumitomo Mitsui Financial Group, Yamaha Motor Co., Ltd., Hanwha Semitech Co., Ltd., Panasonic Holdings Corporation, Mycronic, Universal Instruments Corporation, SHIBUYA CORPORATION, Newbury Electronics Ltd, Goldland, ATMWA, Production Logix, TechPoint Group, Hang Zhou Tronstol technology Co., Ltd., and Electronic Manufacturing Services Group, Inc.

Additionally, ongoing advancements in automation and robotics have enhanced the functionality of chip mounters, enabling improved placement accuracy and operational efficiency. The integration of AI and machine vision in SMT processes further supports real-time quality control and predictive maintenance, contributing to production optimization.

• In January 2025, Murata Manufacturing Co., Ltd. developed the world’s smallest class 006003-inch size (0.16 mm x 0.08 mm) chip inductor, which will be showcased at CES 2025. The innovation represents a 75% volume reduction compared to previous models and supports the increasing demand for high-density component mounting in compact electronic devices.

Key Highlights:

1. The global chip mounter market size was valued at USD 6.32 billion in 2023.
2. The market is projected to grow at a CAGR of 5.37% from 2024 to 2031.
3. Asia Pacific held a market share of 39.72% in 2023, with a valuation of USD 2.51 billion.
4. The surface mount technology segment garnered USD 4.27 billion in revenue in 2023.
5. The consumer electronics segment is expected to reach USD 2.49 billion by 2031.
6. The market in North America is anticipated to grow at a CAGR of 5.42% during the forecast period.

Market Driver

Rising Demand for Miniaturization and Smart Manufacturing

The market is registering accelerated growth, due to the increasing miniaturization of electronic components and the widespread adoption of automation & smart manufacturing systems. The need for chip mounters capable of placing ultra-miniature components with exceptional precision is growing as electronic devices from smartphones and tablets to wearables and medical instruments become smaller and more compact.

The development of sub-millimeter parts components demands equipment with high placement accuracy, stability, and advanced vision systems. This miniaturization trend not only challenges conventional surface mount technology but also compels manufacturers to upgrade their assembly lines with mounters that can support denser layouts and multi-functional board designs without compromising yield or reliability.

Additionally, the push for smart manufacturing is revolutionizing production strategies across the electronics sector. Chip mounters are increasingly expected to integrate with intelligent factory ecosystems that feature automation, Machine Learning (ML), predictive maintenance, and real-time process monitoring.

These advanced capabilities allow manufacturers to optimize line throughput, maintain high-quality standards, and respond quickly to customization demands or volume fluctuations. Smart manufacturing also supports error reduction, lowers production costs, and shortens time-to-market.

• In July 2024, Delta introduced its Press-Fit Smart Machine for the Printed Circuit Board Assembly (PCBA) industry to address challenges like uneven force, misalignment, and bent pins. The machine offers real-time monitoring, automated operations, and data tracking, improving yield rates and reducing rework. Designed for solder-free, environmentally friendly production, it is especially beneficial for automotive and server electronics manufacturing.

Market Challenge

High Equipment Costs

One of the most pressing challenges in the chip mounter market is the significant cost associated with acquiring, installing, and maintaining advanced SMT equipment. Modern chip mounters are engineered with highly precise placement heads, real-time optical inspection systems, force sensors, and software-driven intelligence to meet growing demands for miniaturization, speed, and defect-free assembly.

However, this level of technological sophistication is available at a premium, resulting in capital expenditures that can strain the budgets of many small and medium-sized enterprises and limit their ability to compete with larger, better-funded manufacturers. Beyond the initial purchase, the cost burden continues through the need for specialized operators, periodic calibration, software updates, and maintenance contracts.

Industry stakeholders are increasingly turning to scalable, modular automation platforms that allow manufacturers to expand capacity and capabilities gradually. Instead of purchasing entire systems upfront, these solutions let users start with a basic configuration and integrate additional heads, feeders, or inspection tools as needed.

Market Trend

Integration of Advanced Quality Control Systems and Regional Expansion

The market is undergoing significant transformation driven by the integration of advanced quality control systems and the expansion into emerging regional manufacturing hubs.

End-use industries such as automotive, aerospace, and medical electronics are imposing stricter standards for component placement accuracy and production traceability, thus, manufacturers are integrating sophisticated quality assurance technologies into chip mounters.

These include real-time component verification systems, precision placement force sensors, vacuum monitoring, and inline inspection tools. Such systems enhance first-pass yield, reduce rework rates, and ensure compliance with increasingly rigorous quality certifications, thereby boosting customer confidence and operational reliability.

Simultaneously, the market is registering a geographic shift with growing investments in emerging regional hubs. These regions are attracting electronics manufacturing, due to favorable government policies, growing local demand, cost-effective labor, and the need to diversify global supply chains.

As a result, chip mounter vendors are expanding their presence in these markets by partnering with local firms, establishing service and support infrastructure, and tailoring their solutions to meet the unique production needs of these regions. This regional expansion is not only unlocking new revenue streams for equipment providers but also strengthening the resilience and scalability of the global electronics manufacturing ecosystem.

• In March 2025, Yamaha Robotics introduced three new performance options for its YRM series surface mounters, including nozzle force measurement, LCR component verification, and extended board size handling, to boost SMT productivity and meet the high-quality demands of the automotive and aerospace sectors.

Chip Mounter Market Report Snapshot

Segmentation	Details
By Technology	Hole Technology, Surface Mount Technology, Fine Pitch Technology
By Application	Consumer Electronics, Medical, Automotive, Telecommunication, Others
By Region	North America: U.S., Canada, Mexico
	Europe: France, UK, Spain, Germany, Italy, Russia, Rest of Europe
	Asia-Pacific: China, Japan, India, Australia, ASEAN, South Korea, Rest of Asia-Pacific
	Middle East & Africa: Turkey, UAE, Saudi Arabia, South Africa, Rest of Middle East & Africa
	South America: Brazil, Argentina, Rest of South America

Market Segmentation

• By Technology (Hole Technology, Surface Mount Technology, Fine Pitch Technology): The surface mount technology segment earned USD 4.27 billion in 2023, due to its ability to support high-speed, high-density component placement essential for modern electronic manufacturing.
• By Application (Consumer Electronics, Medical, Automotive, Telecommunication, Others): The consumer electronics segment held 39.44% share of the market in 2023, due to the rising demand for compact, multifunctional devices such as smartphones, tablets, and wearables.

Chip Mounter Market Regional Analysis

Based on region, the market has been classified into North America, Europe, Asia Pacific, Middle East & Africa, and South America .

Asia Pacific accounted for 39.72% share of the chip mounter market in 2023, with a valuation of USD 2.51 billion. This dominance is primarily attributed to the region’s highly concentrated electronics manufacturing base, particularly in China, South Korea, Japan, and Taiwan.

These countries are home to major Original Equipment Manufacturers (OEM) and Electronics Manufacturing Services (EMS)  providers that require high-volume, high-speed chip mounters to meet the production demands of smartphones, computers, and automotive electronics.

The presence of large-scale manufacturing hubs, robust semiconductor supply chains, and continuous investments in surface-mount technology infrastructure have further cemented Asia Pacific’s leadership in the market. Additionally, rising consumer demand for advanced electronics in emerging economies such as India and Southeast Asia is accelerating equipment deployment across the region.

Countries like Vietnam and Thailand are also registering increased foreign direct investment in electronics assembly plants, further boosting the demand for chip mounters. The prevalence of low-cost labor, proximity to component suppliers, and technological expertise in SMT production made the region a global hotspot for electronics manufacturing.

• In November 2024, Siemens Digital Industries Software announced that Sat Nusapersada, a major Electronics Manufacturing Services (EMS) provider in Indonesia, adopted Siemens’ Process Preparation software to accelerate New Product Introduction (NPI) and enhance efficiency across its Surface Mount Technology (SMT) lines. The implementation resulted in a 70% reduction in project data preparation time, a 23% improvement in line efficiency, and a 21% reduction in SMT programming time.

The chip mounter market in North America is expected to register the fastest growth, with a projected CAGR of 5.42% over the forecast period. This growth is largely driven by the region’s strategic push to localize semiconductor and electronics manufacturing, especially in the U.S. and Mexico.

The resurgence of domestic chip production fueled by the rising demand in defense, aerospace, and automotive sectors, particularly for EVs and Advanced Driver Assistance Systems (ADAS) components, is prompting investments in advanced SMT assembly lines. In addition, Mexico is emerging as a key electronics manufacturing destination due to its geographic proximity to the U.S. and its growing base of contract manufacturers.

The rise in demand for highly automated production systems, integration of smart factory technologies, and increased R&D activities in high-reliability electronics are further contributing to the regional market growth.

Regulatory Frameworks

• In the U.S., chip mounters classified under electronic assembly equipment are regulated under the Occupational Safety and Health Administration (OSHA) for workplace safety, and must comply with IPC standards and ANSI regulations for manufacturing practices.
• In the European Union (EU), chip mounters fall under the EU Machinery, Low Voltage Directive, and Electromagnetic Compatibility Directive, ensuring safety, energy efficiency, and interference compliance.
• In Japan, the Ministry of Economy, Trade and Industry (METI) oversees the regulation of semiconductor manufacturing equipment, including chip mounters, under the Industrial Standardization Law, which enforces Japanese Industrial Standards (JIS).

Competitive Landscape

The chip mounter market is characterized by rapid technological advancement and a strong focus on precision & automation. Key players in the market are actively pursuing strategies centered around product innovation, with an emphasis on enhancing placement speed, accuracy, and flexibility to support increasingly complex PCB designs.

Leading companies are investing heavily in R&D to develop next-generation chip mounters integrated with AI-based inspection systems, ML algorithms, and real-time process optimization capabilities to stay ahead in a highly dynamic environment. Strategic partnerships and collaborations with semiconductor and electronics manufacturers are also common, enabling solution customization and faster time-to-market.

In addition, many players are expanding their global footprint through localized manufacturing facilities and technical support centers in high-growth regions. After-sales services, predictive maintenance solutions, and software upgrades have become critical components of competitive positioning, as companies aim to build long-term client relationships and ensure equipment uptime in high-volume production environments.

• In September 2024, ASMPT and Tata Electronics Pvt. Ltd. signed a Memorandum of Understanding (MoU) to establish semiconductor assembly equipment infrastructure in India. The partnership aims to support Tata's upcoming facilities in Karnataka and Assam, focusing on workforce training, service engineering, automation, and R&D in wire bond, flip chip, and advanced packaging technologies.

List of Key Companies in Chip Mounter Market:

• ASM International N.V.
• Sumitomo Mitsui Financial Group
• Yamaha Motor Co., Ltd.
• Hanwha Semitech Co., Ltd.
• Panasonic Holdings Corporation
• Mycronic
• Universal Instruments Corporation
• SHIBUYA CORPORATION
• Newbury Electronics Ltd
• Goldland
• ATMWA
• Production Logix
• TechPoint Group
• Hang Zhou Tronstol technology Co., Ltd.
• Electronic Manufacturing Services Group, Inc.

Recent Developments (M&A/Partnerships/Agreements/Product Launches)

• In April 2025, Active-PCB Solutions installed a new conveyor and buffering/stacking system to enhance its SMT line. The upgrade aims to reduce manual PCB handling, streamline operations, and improve throughput by automating board movement between production stages. This development enhances production efficiency, reduces the risk of human error, and optimizes workflow reliability in SMT assembly.
• In October 2024, Cree LED introduced its CV28D-FCC LED powered by patented FusionBeam Technology, combining the benefits of through-hole and surface-mount RGB LED technology. Designed for high-resolution signage applications, the CV28D offers enhanced directionality, superior image quality, and compatibility with pick-and-place and reflow soldering, enabling efficient automated assembly and improved display performance across various environments.
• In July 2024, Samsung Electro-Mechanics announced its collaboration with AMD to supply high-performance substrates for hyperscale data center computing. The partnership aims to support next-generation CPU/GPU applications by integrating multiple chiplets on advanced substrates with larger surface areas and higher layer counts, addressing challenges in power delivery, signal integrity, and chip mounting precision.