Kings Research today announced the release of its latest market intelligence study, “Global ABF Substrate Market: Size, Share, Trends & Forecast 2023–2030.” The report delivers an in-depth analysis of the market’s growth trajectory, including forecasts, drivers, opportunities, and competitive dynamics.
According to Kings Research, the global ABF substrate market was valued at USD 998.7 million in 2022 and is projected to grow to USD 4,399.5 million by 2030, at a CAGR of 20.10% during 2023–2030. Rising demand for high-performance semiconductor packaging, driven by the expansion of 5G, AI, and IoT applications, is fueling ABF substrate adoption across industries.
Ajinomoto build-up film (ABF) substrates are advanced packaging materials used in semiconductor manufacturing to connect integrated circuits to circuit boards with high density and reliability. ABF substrates are key to high-performance computing, enabling miniaturization and faster signal transmission and heat dissipation. As electronics get smaller and more powerful, ABF substrates are becoming essential for next-gen devices.
Kings Research identifies the following growth drivers:
- Semiconductor Industry Growth
The semiconductor industry is booming with AI, 5G, and automotive electronics. The US government’s 100-Day Supply Chain Review Report highlights the growing demand for semiconductor materials, including ABF substrates, to meet the needs of these emerging technologies.
- Advanced Packaging Trends
The shift to chiplet architectures and 3D packaging is creating huge demand for ABF substrates. Research from the National Institute of Standards and Technology (NIST) emphasizes the importance of advanced packaging technologies such as heterogeneous integration and wafer-level packaging, which require high-performance substrates like ABF to achieve desired interconnect densities and performance levels.
- Consumer Electronics Growth
The rapid growth of consumer electronics, including smartphones, wearables, and IoT devices, is driving demand for ABF substrates. According to the US Department of Energy’s Energy Supply Chain Report, the increasing adoption of smart mobile wireless devices requires advanced semiconductor packaging solutions such as those provided by ABF substrates to support miniaturization and functionality of these devices.
- Regional Innovation
Asia-Pacific regions, particularly Taiwan, South Korea, and China, are leading in ABF substrate demand due to strong semiconductor manufacturing capabilities. These regions have invested heavily in semiconductor infrastructure, boosting the need for advanced packaging materials like ABF substrates.
For decision-makers—CIOs, CTOs, COOs—the ABF substrate market offers strategic opportunities:
- Performance Gains: Better signal integrity and lower latency for high-speed electronics.
- Miniaturization: Smaller designs for mobile, wearable, and AI devices.
- Reliability: Higher thermal stability and mechanical robustness for mission-critical applications.
- Competitive Differentiation: Early adoption for performance-driven sectors like HPC and automotive electronics.
Regional Outlook
- Asia-Pacific: Biggest market and fastest growing region, driven by semiconductor manufacturing hubs in Taiwan, South Korea, and China, with Unimicron Technology and Nan Ya PCB leading the charge. This growth is due to rapid industrialization in countries like India, China, and Japan, and the increasing production of electronic devices and the growth of the IT industry.
- North America: North America is growing in the ABF substrate market, driven by semiconductor innovation and increasing demand for high-performance computing solutions. Investments in advanced packaging are driving the market, with the CHIPS and Science Act encouraging the construction of US-based substrate facilities that can produce ABF substrates for AI and HPC end uses.
Competitive Landscape
Key market players are investing in capacity expansion, R&D, and strategic partnerships. Leading companies include Ajinomoto Co., Inc., Unimicron Technology Corp., Nan Ya Printed Circuit Board Corporation, Kyocera, ASE Material, LG Inno Tek, Shennan Circuit, Samsung Electro-Mechanics (SEMCO), TOPPAN, and AT&S.
The full Kings Research report offers detailed segmentation by type, application, geography, and competitive benchmarking. To request a sample, access the full report, or explore custom consulting services, please visit https://www.kingsresearch.com/abf-substrate-market-55.
About Kings Research
Kings Research is a global provider of syndicated research reports and consulting services, helping organizations navigate emerging markets, assess opportunities, and make informed business decisions.
All market data are sourced from Kings Research proprietary analysis, validated against credible industry sources. Examples cited include the National Institute of Standards and Technology (NIST), the U.S. Department of Energy, and the BidenWhiteHouse.